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Rigid Polyimide 4-Layer 1.8mm High-Temperature PCB
PCB Material:Rigid Polyimide / 1.8mm finished thickness
MOQ:1PCS
Price:49.99-169 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:10-18 working days
Payment Method:T/T, Paypal
 

Rigid Polyimide 4-Layer PCB 1.8mm Thick with HASL Lead-Free Finish for High-Temperature Applications


1.Introduction to Rigid Polyimide Material

Polyimide is a high-performance polymer known for its outstanding thermal stability, mechanical strength, and electrical insulation. It maintains exceptional peel strength (1.42 N/mm after thermal stress, 1.13 N/mm after process exposure) and superior electrical properties (volume resistivity: 6.6×10⁶ MΩ·cm under C-96/35/90 conditions). With a dielectric constant of 4.12 and dissipation factor of 0.0072 at 1MHz, polyimide excels in high-frequency applications. Its moisture resistance (0.11% absorption), high dielectric strength (44.3 kV), and thermal resilience (no delamination at 288°C, Tg 257°C) make it indispensable for aerospace, military, and high-temperature environments.


2.Key Features

Thermal Stability: Tg of 257°C, withstands 288°C thermal stress.
Mechanical Strength: Bending strength of 410.2 N/mm² (machine direction).
Electrical Performance: Volume resistivity of 6.6×10⁶ MΩ·cm, dielectric constant of 4.12.
Moisture Resistance: 0.11% absorption rate.
High-Frequency Suitability: Low dissipation factor (0.0072 at 1MHz).


3.Benefits

Reliability: Maintains performance in extreme temperatures and harsh conditions
Durability: Excellent peel strength and mechanical robustness.
Electrical Integrity: Stable dielectric properties for high-frequency applications.
Versatility: Suitable for aerospace, military, and industrial uses.


Rigid Polyimide PCB


4.PCB Construction Details

SpecificationTechnical Details
Base MaterialRigid Polyimide
Layers4
Board Dimensions325×83mm (±0.15mm)
Trace/Space5/5 mils
Min. Hole Size0.3mm
Board Thickness1.8mm
Copper Weight1oz outer layers (35μm)
Via Plating20μm
Surface FinishLead-free HASL
SilkscreenWhite (both sides)
Solder MaskBlack (both sides)
Via Treatment0.3mm resin-filled & capped
Countersink HolesTop side
Electrical Test100% tested

5.PCB Stackup (4-Layer Rigid Structure)

Copper layer 1 - 35 μm
Polyimide Core - 0.32 mm
Copper layer 2 - 35 μm
Polyimide Prepreg - 0.1mm
Polyimide Core - 0.8mm
Polyimide Prepreg - 0.1mm
Copper layer 3 - 35 μm
Polyimide Core - 0.32 mm
Copper layer 4 - 35 μm


6.PCB Statistics:

Components: 68
Total Pads: 102
Thru Hole Pads: 47
Top SMT Pads: 39
Bottom SMT Pads: 16
Vias: 121
Nets: 12


7.Typical Applications

Aerospace and aviation electronics
Military equipment
Downhole oil extraction systems
High-temperature industrial applications


8.Quality Assurance

IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support


 

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